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Electronic potting adhesive

Electronic potting compound, thermal conductive potting compound, epoxy resin potting compound, silicone potting compound, polyurethane potting compound, and LED potting compound are in liquid form before curing and have fluidity. The viscosity of the adhesive varies depending on the material, performance, and production process of the product. After curing, it can play the roles of waterproofing, moisture-proofing, dust-proofing, insulation, heat conduction, confidentiality, anti-corrosion, temperature resistance and shock absorption.

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Physical and chemical properties

What are the classifications of electronic potting compounds? There are a wide variety of electronic potting compounds, mainly including: thermal conductive potting compounds, epoxy resin potting compounds, silicone potting compounds, polyurethane potting compounds, and LED potting compounds.

Thermal Conductive Potting Compounds

Thermal conductive potting compounds (HCY) are low - viscosity, flame - retardant, two - component addition - type silicone thermal conductive potting compounds.

Silicone Potting Compounds

There are many types of silicone potting compounds. Different types of silicone potting compounds vary greatly in terms of temperature resistance, waterproof performance, insulation performance, optical performance, adhesion to different materials, and hardness.

Polyurethane Potting Compounds

Polyurethane potting compounds, also known as PU potting compounds, are usually made by the step - by - step polymerization of polyols of oligomers such as polyesters, polyethers, and polybutadienes with diisocyanates, using diols or diamines as chain extenders.

LED Potting Compounds

LED potting compounds are auxiliary materials for LED packaging. They have a high refractive index and high light transmittance, which can protect the LED chips and increase the luminous flux of LEDs.

Application

It is used for the potting protection of general electronic components, power modules and circuit boards, as well as the potting of various electronic appliances, such as automotive HID lamp module power supplies, automotive ignition system module power supplies, network transformers, etc.

I. Packaging Specifications

There are differences in the packaging specifications of electronic potting adhesives from different brands and types. However, they are usually packaged in a two-component form, that is, Component A (main agent) and Component B (curing agent) are packaged separately to ensure that no reaction occurs during transportation and storage.

II. Storage Conditions

The storage conditions of electronic potting compounds are crucial for their performance and service life. Most products are recommended to be stored in a cool, dry, and well-ventilated environment, avoiding direct sunlight and high temperatures.

For more information on Safety Data Sheets (MSDS), Product Safety Data Sheets, and Product Inspection Reports, please contact us.

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