Methylphenyl Cyclosiloxane Mixture （HC-7803）

1,3-Dimethyl-1,1,3,3-tetraphenyldisiloxane is a high-phenyl-content organosilicon intermediate. Featuring a unique symmetrical molecular structure with “dual methyl and tetraphenyl” groups, it combines the high heat resistance, radiation resistance, and excellent optical properties of phenylsiloxanes with the good compatibility of methylsiloxanes. It serves as a key raw material for preparing high-performance phenyl silicone rubber, silicone resins, optical materials, and high-temperature-resistant coatings, as well as a chain-terminating agent for phenyl silicone oils. The product is widely suitable for material upgrade requirements in precision fields such as aerospace, electronic information, and high-end manufacturing.

Triphenylsilanol is a specialty organosilicon compound that combines ultimate structural stability with high-efficiency interfacial reactivity. In its molecular structure, the triphenyl groups endow materials with outstanding thermal resistance, radiation resistance, yellowing resistance and mechanical toughness through the steric hindrance effect. The hydroxyl groups (-OH) possess direct condensation reactivity; without the intermediate hydrolysis step, they can rapidly form stable chemical bonds with silanols, hydroxyl resins and hydroxyl groups on filler surfaces. As a core functional additive for high-end silicone resin crosslinking, specialty organosilicon modification and precision filler functionalization, the product leverages the dual advantages of stable performance without attenuation and high reaction efficiency. It is widely used in fields with stringent requirements for material performance and processing precision, such as aerospace, high-end electronic manufacturing, medical devices, special coatings and precision composites, providing comprehensive performance assurance for end products. Its additional applications are as follows: Surfactant: Triphenylsilanol can serve as a surfactant with excellent surface tension reduction capability, and is widely used in various chemical and industrial applications. Wetting Agent: It can also be used to improve the wetting properties of certain materials, such as coatings, dyes and paints. Papermaking Additive: It acts as a papermaking additive to enhance the wet strength and wettability of paper. Sealing Wax Agent: In electronic assembly and packaging processes, triphenylsilanol can be used as a sealing wax agent to improve the adhesion and heat resistance of packaging materials.

Triphenylmethoxysilane is a specialty organosilicon compound combining ultimate structural stability with high-efficiency reactivity. In its molecular structure, the triphenyl groups endow materials with outstanding thermal resistance, radiation resistance, yellowing resistance and mechanical toughness, while the methoxy groups provide precise cross-linking and interfacial bonding capabilities. It serves as a core functional additive for high-end silicone resin synthesis, specialty organosilicon modification and filler modification under harsh environments. Widely used in aerospace, nuclear industry, high-end electronic manufacturing, medical devices, special coatings and other fields with stringent material performance requirements, it provides comprehensive performance assurance for end products.

Diphenyldihydroxysilane is an organosilicon compound featuring both high reactivity and structural stability. In its molecular structure, the dihydroxy groups deliver high-efficiency cross-linking and bonding capabilities, while the diphenyl groups endow materials with outstanding thermal resistance, aging resistance and radiation resistance. It serves as a core functional additive for silicone resin cross-linking, organosilicon material modification, filler surface functionalization and other fields. It can be used as a silicone rubber structure controller to reduce structuring tendency and improve processability; as a raw material to synthesize phenyl silicone oils, phenyl silicone resins and phenyl silicone rubbers; and as a modification intermediate for polyurethane resins, epoxy resins, acrylic resins, PP, PET, PE and more, imbuing new products with thermal resistance, radiation resistance and aging resistance. Leveraging its unique structural synergistic advantages, the product is widely applied in high-end manufacturing sectors including electronics, aerospace, coatings, new chemical materials and medical devices, providing excellent comprehensive performance support for end products.